Some exciting new products from AMD coming soon … RDNA3 and Zen4, I can’t wait! *drool*
Taken from TPU … AMD later this month is preparing to address investors as part of a yet-unknown event. The company typically hosts Financial Analyst Day events around Q1-Q2, and goes to the investors with substantial material on the current state of the organization, the products on offer, what’s on the horizon, and how it could impact the company’s financials. An alleged presentation related to the November 2021 event was leaked to the web. The presentation provides a guided tour of the entire product portfolio of the company, spanning server processors, compute accelerators, consumer graphics, some client processors, and the semi-custom business.
The presentation outlines that the company has so far successfully executed its roadmaps for the client-CPU, server-CPU, graphics, and compute-accelerator segments. In the client CPU segment, it shows a successful execution up to 2021 with the “Zen 3” microarchitecture. In the server space, it mentions successful execution for its EPYC processors up to “Zen 3” with its “Milan” processors, and confirms that its next-generation “Zen 4” microarchitecture, and its sister-architecture, the “Zen 4c,” will be built on the 5 nm silicon fabrication node (likely TSMC N5). The presentation also details the recently announced “Milan-X” processor for existing SP3 platforms, which debuts the 3D Vertical Cache technology, bringing up to 96 MB of L3 cache per CCD, and up to 768 MB of L3 cache (804 MB L1+L2+L3 cache) per socket.
Read the rest at TPU
